CE760-0 - Radisys CE760-0 COM Express Module. Intel 2GHz Pentium M 760...
- Part Number:
- CE760-0
- Model Number:
- CE760-0
- Make:
- RADISYS
- Lead Time:
- Available
- Qty In Stock:
- Available
Radisys CE760-0 COM Express Module. Intel 2GHz Pentium M 760 BGA Processor | Memory module not included Simple Type: CPU Board
Based on the open PICMG standard, the RadiSys Procelerant CE COM Express module combines Intel Pentium M and Celeron M performance with key features vital for today’s embedded applications. Paired with a RadiSys Procelerant CR carrier board, the RadiSys family of COM Express modules provides a final production or a design-specific development platform.
For Resellers and High Volume Orders:
Please request a quote to obtain preferred pricing.
Features
- 1 ATA 100 Port
- 125mm)
- 1GB DDR2 Memory
- 2 SATA Ports
- 2GHz Pentium M and 1.5GHz
- 3*PCI-Express x1 PCI Express
- 8 GPIO Lines
- 8 USB Ports
- Analog VGA
- Basic Form Factor (95mm x
- Celeron M combined with
- COM Express Standard Features
- Dual SDVO
- Ethernet Controller
- Express Module
- Flexible PCI-Express Options
- Hat Desktop Linux
- Heatskinks Available
- Integrated Graphics
- Intel 82573 10/100/1000BaseTX
- Intel 915GM Chipset on COM
- Intel ICH6M I/O Hub
- LVDS
- One SODIMM Socket for up to
- Optimized Passive and Active
- PCI 32-bit/33MHz PCI Bus
- Phoenix BIOS with ACPI 2.0
- PICMG COM Express Compliant
- Ports
- Power Management
- TV out
- Type 2 COM Express Pin-out
- Win XP/Win XP Embedded/Red
Specifications
- Audio Compliance: AC ‘97 Intel High Definition Audio via ICH6M I/O Hub
- BIOS: Support National Semiconductor PC8374, Ask about support for Winbond W83627HF-AW
- BIOS Type: 1MB, Phoenix Technologies
- Capacity: Up to 1GB DDR2 in a single channel (Market Availability)
- Chipset: Intel 915GM with ICH6M I/O Hub
- Compliance: PICMG COM Express R1.0 Basic Form Factor, Type 2
- Connectors: COM Express (2) 220 pin COM Express standard connectors. Module connector pn: Tyco 3-1827231-6, Carrier connector pn: Tyco 3-3-1827233-6
- Dimensions: 95mm x 125mm - COM Express Basic Form Factor
- Dissipation 3D Mark (Max): CE 760: 30.3W CE370: 26.5W
- Environment Temperature: 0º – 60ºC (operation), -40º – 85º (non-operating)
- External: PCI-Express x16 Graphics Port, Multi-plexed on SDVO interface pins
- Features: Dual SVDO, LVDS 18-bit dual channel, Analog VGA, TV Out
- Features: Integrated video, PCI, IDE, PCI-Express, SATA, USB, LPC, GPIO
- Humidity: 5% to 95% Condensing (Operating), 5% – 90% RH Non-Condensing at 40C
- IDE: One Ultra ATA100/66/33 port
- Memory Type: Single 200-pin SO-DIMM socket, supports 400 and 533 Memory
- Networking Type: IEEE 802.3 10BASE-T/100BASE-TX/1000BASE-T Compliant Physical Layer via Intel 82573V - Utilizes (1) PCI-Express x1 interfaces
- OTHER: LPC, Smbus/I2C Bus
- Package: BGA
- PCI: PCI 2.3 32-bit 33MHz, four logical devices
- PCI Express: 3*PCI-Express x1 and 1*PCI-Express x16
- Performance Clock Speed/FSB/Cache: 2GHz/533MHz FSB / 2MB Cache
- Power: 27W / 21W / 10W / 5W (Processor only)
- Power Input: 12V input from carrier board (5V standby)
- Processor: Intel Pentium M
- Processor: Intel Pentium M 760, LV Pentium-M 738, Celeron M 370, ULV Celeron-M 373
- SATA: Two SATA 150 ports
- Shock: 30G, trapezoidal 11ms duration
- USB: Eight USB 2.0 / 1.1 ports
- Vibration Operating: 30G, half sine 11ms duration, Storage: 50G, half sine 11ms duration 30G
- Video Type: Dual Independent Displays via Intel 915GM Chipset
Applications
- None Available
Aliases
- None Available
